package dimensions a b c d e f g h i j k l m n p q dim. .970 .380 .225 --- .010 --- .500 .018 .008 --- 0 .025 min. .990 .400 .245 --- .015 --- .520 .022 .012 --- 8 .045 max. .980 .390 .235 .700 .013 .100 .510 .020 .010 .140 --- .035 .030 .100 .090 .560 nom. (inches) (millimeters) 24.64 9.65 5.72 --- .254 --- 12.70 .457 .203 --- 0 .635 min. 25.15 10.16 6.22 --- .381 --- 13.20 .559 .305 --- 8 1.14 max. 24.89 9.91 5.97 17.78 .330 2.54 12.95 .508 .254 3.56 --- .889 .762 2.54 2.29 14.22 nom. common mode rejection (db min.) crosstalk (db min.) [between channels] return loss (db min.) -40 1-100 mhz insertion loss (db max.) 1-80 mhz -1 xmit rcv -1 30-60 mhz -12 xmit rcv -12 1-30 mhz -18 xmit rcv -18 60-100 mhz -8 xmit rcv -10 1-30 mhz -40 xmit rcv -40 30-100 mhz xmit -30 rcv -30 100-200 mhz xmit -25 rcv -25 ? isolation : 1500 vrms ? cable impedance : 100 w ? electrical parameters @ 25 c 100 base-x interface module csf8019gma rev. b 10/20/98 ? optimized to work with ml6692/94 phy chip ? ? guaranteed to operate with 8 ma dc bias at 70 c on cable side ? ? complies with or exceeds ieee 802.3, 100 bx standards ? ? robust construction allows for severe soldering processes ? schematic EPF8019GM 100 khz, 0.1 vrms 8 ma dc bias @ 70 c 350 cable side e l e c t r o n i c s i n c . transmit channel 3 1 8 7 2 2ct:1 chip side cable side receive channel 9 10 16 15 13 12 1:1:1 chip side cable side g l k p pad layout q m n a b pca EPF8019GM date code pin 1 i.d. d (j) h f e c i tel: (818) 892-0761 fax: (818) 894-5791 http://www.pca.com pca electronics, inc. 16799 schoenborn st . north hills, ca 91343 ocl ( m h min.) 80-100 mhz -2 xmit rcv -2 product performance is limited to specified parameters. data is subject to change without prior notice.
csf8019gmb rev. b 10/20/98 100 base-x interface module the circuit below is a guideline for interconnecting pcas EPF8019GM with ml6692 or ml6694 chip applications. further details can be obtained from the chip manufacturer application notes. typical insertion loss of the isolation transformer is 0.5db. this parameter covers the entire spectrum of the encoded signals in 100 bx protocol. under terminated conditions, to transmit a 2v pk-pk signal across the cable, you must adjust the chips supporting resistor to get at least 2.12v pk-pk across the transmit pins. note that in the 100 bx application, you need to use only one half of the rcv side primary winding and terminate it with 50 w balanced load as shown. the phantom resistors shown around the connector have been known to suppress unwanted radiation that unused wires pick up from the immediate environment. their placement and use are to be considered carefully before a design is finalized. it is recommended that there be a neat separation of ground planes in the layout. it is generally accepted practice to limit the plane off at least 0.05 inches away from the chip side pins of EPF8019GM. there need not be any ground plane beyond this plane. for best results, pcb designer should design the outgoing traces preferably to be 50 w , balanced and well coupled to achieve minimum radiation from these traces. typical application circuit for utp notes : * nic side is shown. hub side connection will swap pins 3-6 with 1-2. ml6692 or ml6694 rj45* 1 2 6 3 4 5 7 8 tx+ tx- rx+ rx- chassis ground 50 w 50 w EPF8019GM 50 w high voltage capacitor 50 w xmit rcv 2 200 w 200 w capacitor EPF8019GM e l e c t r o n i c s i n c . 1 3 13 12 7 8 10 9 tel: (818) 892-0761 fax: (818) 894-5791 http://www.pca.com pca electronics, inc. 16799 schoenborn st. north hills, ca 91343
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